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Introducing the Rugged Science EAC-4000, powered by the NVIDIA® Jetson Orin™ NX/Nano platform. This compact system features a 1024-core NVIDIA Ampere™ architecture GPU with 32 Tensor cores and an 8-core Arm® Cortex®-A78AE CPU, delivering up to 100 TOPS of AI performance. With a maximum of 16GB LPDDR5 and 2 NVDLA engines, the EAC-4000 is built for demanding Edge AI applications. It includes 1 GigE LAN, 4 USB ports, 1 HDMI port, and 2 COM RS-232/422/485 ports, making it perfect for space-constrained scenarios like traffic vision, AOI, delivery robots, and other advanced AI-driven solutions.

Model

Platform

RAM

LAN

USB 3.1

Serial

SIM

HDMI

4000-XR16-SXXX

Jetson Orin NX

16GB

1

4

2

1

1

4000-XR08-SXXX

Jetson Orin NX

8GB

1

4

2

1

1

4000-AR08-SXXX

Jetson Orin Nano

8GB

1

4

2

1

1

4000-AR04-SXXX

Jetson Orin Nano

4GB

1

4

2

1

1

Model

CPU

GPU

4000-XR16-SXXX

8-core Arm® Cortex® -A78AE v8.2 64-bit CPU

NVIDIA Ampere™ architecture w/1024 NVIDIA® CUDA® cores, 32 Tensor cores

4000-XR08-SXXX

6-core Arm® Cortex® -A78AE v8.2 64-bit CPU

NVIDIA Ampere™ architecture w/1024 NVIDIA® CUDA® cores, 32 Tensor cores

4000-AR08-SXXX

6-core Arm® Cortex® -A78AE v8.2 64-bit CPU

NVIDIA Ampere™ architecture w/1024 NVIDIA® CUDA® cores, 32 Tensor cores

4000-AR04-SXXX

6-core Arm® Cortex® -A78AE v8.2 64-bit CPU

NVIDIA Ampere™ architecture w/512 NVIDIA® CUDA® cores, 16 Tensor cores

System
CPU
EAC-4000-XR16 : 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU
EAC-4000-XR08/EAC-4000-AR08/EAC-4000-AR04 :
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU
GPU
EAC-4000-XR16/EAC-4000-XR08/EAC-4000-AR08 :
NVIDIA Ampere™ architecture w/1024 NVIDIA® CUDA® cores, 32 Tensor cores
EAC-4000-AR04 : NVIDIA Ampere™ architecture w/512 NVIDIA® CUDA® cores, 16 Tensor cores
DL Accelerator
EAC-4000-XR16 : 2 NVDLA Engines
EAC-4000-XR08 : 1 NVDLA Engines
EAC-4000-AR08/EAC-4000-AR04 : None
Memory
EAC-4000-XR16 : 1 LPDDR5 DRAM, 16GB
EAC-4000-XR08/EAC-4000-AR08 : 1 LPDDR5 DRAM, 8GB
EAC-4000-AR04 : 1 LPDDR5 DRAM, 4GB
Software Support
- Linux
- NVIDIA JetPack SDK
I/O Interface 
USB 4 USB 3.1 Type A
Micro USB 1 Micro USB Flash Port
Button
- 1 Power Button
- 1 Force Recovery Button
- 1 Reset Button
LED Power, SSD
SIM 1 Nano SIM Card Socket 
Antenna 2 Antenna for WiFi/4G
Serial  2 COM RS-232/422/485
Expansion
Mini PCIe 1 Mini PCIe (Full-size, PCIe, USB 2.0)
Graphics
Interface 1 HDMI 2.0, up to 4K@60
Video Encode
EAC-4000-XR16/EAC-4000-XR08 :
- HEVC : 1x 4K @60, 3x 4K @30, 6x 1080p @60, 12x 1080p @30
- H.264 : 1x 4K @60, 2x 4k @30, 5x 1080p @60, 11x 1080p @30
Video Decode
EAC-4000-XR16/EAC-4000-XR08 :
- HEVC: Up to 1x 8K @30, 2x 4K @60, 4x 4K @30, 9x 1080p @60, 18x 1080p @30 
- H.264: Up to 1x 4K @60, 2x 4K @30, 5x 1080p @60, 11x 1080p @30
EAC-4000-AR08/EAC-4000-AR04 : 
- HEVC: Up to 1x 4K @60, 2x 4K @30, 5x 1080p @60, 11x 1080p @30
- H.264: Up to 1x 4K @30, 3x 1080p @60, 7x 1080p @30
Storage
M.2 1 M.2 Key M Socket (2242, PCIe 4.0 x4)
Ethernet
LAN 10/100/1000 Base-T GigE LAN, RJ45 Connector
Power
Power Input 12V DC Power Input 
Power Interface 3-pin Terminal Block : V+, V-, Frame Ground
Others
OOB Out-of-band mgmt by Nuvoton NUC980 (Optional, by Module)
TPM Infineon SLB9673 supports TPM 2.0 (Optional)
Mechanical
Dimensions 112 x 103 x 45 mm
Weight 0.6 kg (1.32 lb)
Mounting
- Wallmount
- DIN Rail (Optional)
Environment
Operating Temperature
15W TDP Mode : -25°C to 55°C, with 0.63 m/s air flow
25W TDP Mode : -25°C to 45°C, with 0.63 m/s air flow
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% @55°C
Shock Operating, MIL-STD-810G, Method 516.7, Procedure I
Vibration  Operating, MIL-STD-810G, Method 514.6, Procedure I, Category 4
EMC CE, FCC, EN50155, EN50121-3-2, EN62368-1, MIL-STD-810G
AttachmentSize
PDF icon EAC-4000 Spec Sheet614.34 KB

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