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Featuring the latest Raptor Lake Workstation-grade Platform. The ECX-3000 PEG is powered by the 13th/12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S/Alder Lake-S) running with Intel® R680E PCH supports max 65W TDP CPU. Supports AI computing productivity by NVIDIA® /AMD graphics card, up to 200W power budget. This system is equipped with USB 3.2 Gen 2x2 with a max speed of 20Gbps data transfer, 4 Independent 2.5G LAN with IEEE 802.3at PoE+, Storage with up to 4 front-access 2.5" SSD Tray, M.2 Key M., Support for 5G/Wi-Fi/BT/4G/LTE/GPRS/UMTS, Supports Intel® vPro, TCC, Time-Sensitive Networking (TSN), and TPM 2.0, and DC 12V to 50V wide range power input, Software Ignition Control. The ECX-3000 PEG Series is a perfect combination of performance and ruggedization to facilitate AIoT applications such as Robotic Control, Smart Manufacturing, In-Vehicle Computing, and any Edge AI applications.

ECX-3100-PEG Model Variants

Model

Image

PCIe x16

PCIe x8

PCIe x4

1GbE LANs

2.5GbE PoE+

SSD Trays

USB 3.2

USB Type-C

Isolated DIO

ECX-3800-PEG

2

2

2

4

4

6

1

32

ECX-3600-PEG

2

1

2

4

4

6

1

32

ECX-3400-PEG

1

1

2

4

4

6

1

32

ECX-3200MX-PEG

1

2

4 M12

2

6

1

32

ECX-3200-PEG

1

2

4

2

6

1

32

ECX-3100-PEG

1

2

2

6

1

32

ECX-3100-PEG SERIES CPU OPTIONS

CPU

Cores

GHz

TDP (W)

ECC

i9-13900E

24

5.2

65

Y

i9-13900TE

24

5

35

Y

i7-13700E

16

5.1

65

Y

i7-13700TE

16

4.8

35

Y

i5-13500E

14

4.6

65

Y

i5-13500TE

14

4.5

35

Y

i3-13100E

4

4.4

65

Y

i3-13100TE

4

4.1

35

Y

i9-12900E

16

5

65

Y

i9-12900TE

16

4.8

35

Y

i7-12700E

12

4.8

65

Y

i7-12700TE

12

4.7

35

Y

i5-12500E

6

4.5

65

Y

i5-12500TE

6

4.3

35

Y

i3-12100E

4

4.2

65

Y

i3-12100TE

4

4

35

Y

System
Processor - 24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S)
- 16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
Chipset Intel® R680E Chipset
BIOS AMI
SIO IT8786E
Memory 2 DDR5 SO-DIMM up to 96G
OS Windows 10, Linux
I/O Interface
Serial  4 COM RS-232/422/485
USB
- 6 USB 3.2 Gen 2, USB Type A Connector
- 1 USB 3.2 Gen 2x2, USB Type C Connector supports
max20Gbps data transfer (15W, 5V/3A)
Isolated DIO 16 GPIO
LED Power, HDD, PoE, WLAN
SIM Card  3 External Nano SIM Card Socket
RTC Battery 1 Front-access RTC Battery
Expansion
Mini PCIe 1 Mini PCIe sockets for PCIe/USB/SIM Card
PCIe 1 PCIe x16 Slot
M.2
- 1 M.2 Key B Socket (3042/2280, PCIe/USB 3, default/USB 2)
- 1 M.2 Key B Socket (3052/2280, PCIe/USB 3, default/USB 2)
- 1 M.2 Key E Socket (2230, PCIe/USB)
Graphics
Graphics Processor Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture 
Interface
- 1 DVI-I : Up to 1920 x 1080 @60Hz
- 1 HDMI : Up to 1920 ×1080 @60Hz
- 2 DisplayPort : Up to 7680 x 4320 @60Hz/5120 x 2880 @60Hz
- By requested Graphics Card
Storage
SATA 2 SATA III (6Gbps) support software RAID 0, 1
M.2 1 M.2 Key M Socket (2280, PCIe x4)
Storage Device 2 Front-access 2.5"SSD/HDD Tray
Audio
Audio Codec Realtek ALC888S-VD, 7.1 Channel HD Audio
Audio Interface 1 Mic-in, 1 Line-out
Ethernet
LAN 1 Intel® I219LM GigE LAN
LAN 2 Intel® I210 GigE LAN
Power
Power Input 12V to 50V, DC-in
Power Interface 3-pin Terminal Block : V+, V-, Frame Ground
Ignition Control 16-mode Software Ignition Control
Remote Switch 3-pin Terminal Block 
Others
TPM Infineon SLB9670 supports TPM 2.0, SPI Interface 
Watchdog Timer Reset : 1 to 255 sec./min. per step
Smart Management Wake on LAN, PXE supported
HW Monitor Monitoring temperature, voltages. Auto throttling control when CPU overheats.
Mechanical
Dimension  260mm x 240mm x 79mm (10.24"x9.45"x3.11")
Weight 4.5 kg (9.92 lb)
Mounting
- Wallmount by mounting bracket
- VESA Mount (Optional), Rackmount (Optional)
Environment
Operating Temperature -20°C to 45°C (-4°F to 113°F), with System Fan
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative humidity 95% at 45°C
Shock/Vibration Operating, MIL-STD-810G, Procedure I
EMC CE, FCC, EN50155, EN50121-3-2

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